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Electroless deposition, post annealing and characterization of nickel films on silicon

✍ Scribed by Subir Sabharwal; Siddharth Palit; R. B. Tokas; A. K. Poswal; Sangeeta

Book ID
107582150
Publisher
Springer-Verlag
Year
2008
Tongue
English
Weight
774 KB
Volume
31
Category
Article
ISSN
0250-4707

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## Abstract A one‐step electroless deposition method was developed to synthesize sponge‐like copper film with favourable mechanical adhesion on silicon substrate. X‐ray diffraction and X‐ray photoelectron spectroscopy analysis and field emission scanning electron microscopy observations indicate th