The definitive resource for electroplating, now completely up to date With advances in information-age technologies, the field of electroplating has seen dramatic growth in the decade since the previous edition of Modern Electroplating was published. This expanded new edition addresses these develo
Electroless deposition of pure nickel, palladium and platinum
β Scribed by P. Steinmetz; S. Alperine; A. Friant-Costantini; P. Josso
- Publisher
- Elsevier Science
- Year
- 1990
- Tongue
- English
- Weight
- 651 KB
- Volume
- 43-44
- Category
- Article
- ISSN
- 0257-8972
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π SIMILAR VOLUMES
It was found that the presence of thiourea can increase the electroless nickel ( E N ) deposition rate and hydrogen evolution simultaneously. Influences of thiourea on the electrochemical behaviors of EN solution and activation energy of EN reaction were studied. The composition of the deposit was a
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