Acceleration effect of electroless nickel deposition by thiourea
β Scribed by Han Ke-Ping; Fang Jing-Li
- Publisher
- John Wiley and Sons
- Year
- 1996
- Tongue
- English
- Weight
- 406 KB
- Volume
- 28
- Category
- Article
- ISSN
- 0538-8066
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β¦ Synopsis
It was found that the presence of thiourea can increase the electroless nickel ( E N ) deposition rate and hydrogen evolution simultaneously. Influences of thiourea on the electrochemical behaviors of EN solution and activation energy of EN reaction were studied. The composition of the deposit was also determined by means of X-ray photoelectron spectroscopy (XPSI and Auger electron spectroscopy (AES) The results show that thiourea accelerates the nickel deposition due to interference in the anodic process of E N plating 0 1996
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Electroless nickel coatings on mild steel were exposed to quiescent acidic NaCl solutions. Thick coatings exhibit a frequency dispersion in the Bode phase diagram which has been attributed to a self-protective reaction of the coating involving an enriched phosphorus layer and the electrolyte. The op