𝔖 Bobbio Scriptorium
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Electrodeposition of copper from sulphate solutions — influence of the cations

✍ Scribed by I. Bimaghra; J. Crousier


Book ID
113299741
Publisher
Elsevier Science
Year
1989
Tongue
English
Weight
658 KB
Volume
21
Category
Article
ISSN
0254-0584

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The effects of thiourea on the mechanism of the Cu/Ct?+ system were studied using Pt/Pt and Cu/Pt rotating ring disc electrodes in a 0.7 M CuS04-1.8 M H,SO, solution. Thiourea at low concentrations inhibits the reduction of the intermediate Cu+ to Cu on a copper surface. Thus more Cu+ escapes from t