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Electrical and dielectric behaviors of Ti[sub 3]SiC[sub 2]âhydroxyapatite composites

✍ Scribed by Shi, Sui-Lin; Pan, Wei; Han, Ruo-Bing; Wan, Chun-Lei

Book ID: 121011240
Publisher: American Institute of Physics
Year: 2006
Tongue: English
Weight: 372 KB
Volume: 88
Category: Article
ISSN: 0003-6951
DOI: 10.1063/1.2168684

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