โ Scribed by Suzuki Hiroyuki; Chen Wai-Fah
No coin nor oath required. For personal study only.
๐ SIMILAR VOLUMES
Fracture in a thin elastic/plastic layer bonded by elastic beam-like materials is analytically considered. A direct impetus of this study is to investigate the cracking of a soldered joint commonly seen in electronic systems. A common approach of beam-on-elastic-foundation for bonded joints is exten
Recent evidence has pointed to the possible inadequacy of elastodynamic treatments of rapid crack propagation and crack arrest. This paper describes the development of a dynamic elastic-plastic finite element capability designed to address this concern by taking direct account of crack tip plasticit
B~.sed on the engineering fracture parameter CTOA, a new approach to the structural integrity assessment for non-J-controlled crack growth is proposed in the present paper. When the crack propagation is in the situation of J-controlled crack growth, the single curve assessment method for ductile fra