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Elastic/plastic fracture analysis for bonded joints

✍ Scribed by Shoji E. Yamada

Publisher
Elsevier Science
Year
1987
Tongue
English
Weight
807 KB
Volume
27
Category
Article
ISSN
0013-7944

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✦ Synopsis

Fracture in a thin elastic/plastic layer bonded by elastic beam-like materials is analytically considered. A direct impetus of this study is to investigate the cracking of a soldered joint commonly seen in electronic systems. A common approach of beam-on-elastic-foundation for bonded joints is extended to include elastic/plastic bond response by replacing the plastic zone by a uniformly distributed load on the beam. The solution yields excellent agreement with finite element analysis.

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