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Effects of triethanolamine and polyethylene glycol additives on electrodeposition of Sn–Ag solder alloy

✍ Scribed by Cho, J-K; Kim, J-H; Lim, J-H; Lee, K-H; Kang, S-G

Book ID
126137168
Publisher
Institute of Materials, Minerals and Mining
Year
2011
Tongue
English
Weight
164 KB
Volume
27
Category
Article
ISSN
0267-0836

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## Abstract Corrosion properties of three different Sn‐Ag lead free solder alloys have been investigated in 0.3 wt% Na~2~SO~4~ solution as corrosive environment. As cast solder alloy was analyzed by X‐ray diffraction (XRD) and scanning electron microscopy (SEM). Volume fractions of the Ag~3~Sn in t