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Effects of thermal transport properties on temperature distribution within silicon wafer

✍ Scribed by Wang, Ai-hua; Niu, Yi-hong; Chen, Tie-jun; Hsu, P. F.

Book ID: 121810215
Publisher: Central South University
Year: 2014
Tongue: English
Weight: 707 KB
Volume: 21
Category: Article
ISSN: 2095-2899
DOI: 10.1007/s11771-014-2078-1

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