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Effects of thermal processing on thermal expansion coefficient of a 50 vol.% SiCp/Al composite

✍ Scribed by Byung G Kim; S.L Dong; Su D Park

Book ID: 114192709
Publisher: Elsevier Science
Year: 2001
Tongue: English
Weight: 194 KB
Volume: 72
Category: Article
ISSN: 0254-0584
DOI: 10.1016/s0254-0584(01)00306-6

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