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A study on correlation of thermal mismatch stress of SiCw/Al composite through curves of thermal expansion coefficient

โœ Scribed by Ming Hu; Wei-Dong Fei; Cong-Kai Yao


Book ID
114386902
Publisher
Elsevier Science
Year
2002
Tongue
English
Weight
156 KB
Volume
46
Category
Article
ISSN
1359-6462

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