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Effects of particle size on the thermal expansion behavior of SiCp/Al composites

✍ Scribed by YiWu Yan; Lin Geng

Publisher: Springer
Year: 2007
Tongue: English
Weight: 381 KB
Volume: 42
Category: Article
ISSN: 0022-2461
DOI: 10.1007/s10853-006-1200-7

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