Effects of the structure of the aromatic curing agent on the cure kinetics of epoxy networks
β Scribed by A.C. Grillet; J. Galy; J.P. Pascault; I. Bardin
- Publisher
- Elsevier Science
- Year
- 1989
- Tongue
- English
- Weight
- 842 KB
- Volume
- 30
- Category
- Article
- ISSN
- 0032-3861
No coin nor oath required. For personal study only.
π SIMILAR VOLUMES
## Abstract The effect of fillers on the reaction of liquid epoxy systems cured with __m__βphenylenediamine has been studied within the temperature range 70β170Β°C using a PerkinβElmer differential scanning calorimeter. Quantitative studies have been made with regard to the effect of filler on the k
The epoxy resin containing a typical mesogenic group such as biphenol was cured with catechol novolak and aromatic diamines which have neighboring active hydrogens. In the biphenol-type epoxy resin cured with catechol novolak, 4,4-diaminodiphenylmethane, and p-phenylenediamine (PPD), the glass-rubbe
In this article, the curing kinetics of two fast cure flip-chip epoxy encapsulants under both isothermal and nonisothermal conditions are investigated by differential scanning calorimetry. The method allows determination of the most suitable kinetic model and corresponding parameters. The kinetic an
The curing kinetics of a system containing 4,4-diglycidyloxy-a-methylstilbene (DOMS) and different functionality amines, N-ethylaniline (NEA), aniline, benzenesulfonamide (BSA), and sulfanilamide (SAA), have been studied by differential scanning calorimetry (DSC) under isothermal conditions. The pha