## Abstract A new kinetic model for cure reactios has been developed from the concept of nonequilibrium thermodynamic fluctuation theory in which a distribution function relaxation spectrum is used for explaining cure kinetics of polymerโfiller systems. It is found that an increase in filler loadin
Effect of fillers on kinetics of epoxy cure
โ Scribed by A. Dutta; M. E. Ryan
- Publisher
- John Wiley and Sons
- Year
- 1979
- Tongue
- English
- Weight
- 698 KB
- Volume
- 24
- Category
- Article
- ISSN
- 0021-8995
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โฆ Synopsis
Abstract
The effect of fillers on the reaction of liquid epoxy systems cured with mโphenylenediamine has been studied within the temperature range 70โ170ยฐC using a PerkinโElmer differential scanning calorimeter. Quantitative studies have been made with regard to the effect of filler on the kinetics of cure. Mathematical expressions have been devised to describe the curing reaction as a function of time, temperature, and filler content. These kinetic expressions were found to yield results which were in good agreement with the experimental data for the two fillers studied.
๐ SIMILAR VOLUMES
## Abstract Dynamic mechanical properties of cured epoxy resin filled with mica flake, as twoโdimensional filler, were investigated over the temperature range from room temperature to 200ยฐC. Two series of composite specimens were examined. One is series RM, containing illโoriented mica flakes, and
An analysis of the cure kinetics of several formulations composed of diglycidyl ether of bisphenol-A (DGEBPA) and aromatic diamines, methylenedianiline (MDA) and diaminodiphenyl sulfone (DDS), in the absence and presence of 4,4'-bismaleimidodiphenylmethane (BM) was performed. The dynamic differentia