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The effect of bismaleimide resin on curing kinetics of epoxy–amine thermosets

✍ Scribed by R. Chandra; L. Rajabi; R. K. Soni

Publisher
John Wiley and Sons
Year
1996
Tongue
English
Weight
621 KB
Volume
62
Category
Article
ISSN
0021-8995

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✦ Synopsis

An analysis of the cure kinetics of several formulations composed of diglycidyl ether of bisphenol-A (DGEBPA) and aromatic diamines, methylenedianiline (MDA) and diaminodiphenyl sulfone (DDS), in the absence and presence of 4,4'-bismaleimidodiphenylmethane (BM) was performed. The dynamic differential scanning calorimetry (DSC) thermograms were analyzed with the help of ASTM kinetic software to determine the kinetic parameters of the curing reactions, including the activation energy, preexponential factor, rate constant, and 60 min $ life temperature. The effects of substitution of one curing agent for another, their concentration, and the absence and presence of BM resin and its concentration on curing behavior, enthalpy, and kinetic parameters are discussed.

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