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Kinetics analysis of the curing reaction of fast cure epoxy prepregs

✍ Scribed by L. F. Yang; K. D. Yao; W. Koh

Publisher: John Wiley and Sons
Year: 1999
Tongue: English
Weight: 219 KB
Volume: 73
Category: Article
ISSN: 0021-8995
DOI: 10.1002/(sici)1097-4628(19990822)73:8<1501::aid-app19>3.0.co;2-r

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✦ Synopsis

In this article, the curing kinetics of two fast cure flip-chip epoxy encapsulants under both isothermal and nonisothermal conditions are investigated by differential scanning calorimetry. The method allows determination of the most suitable kinetic model and corresponding parameters. The kinetic analysis suggests that the two-parameter autocatalytic model is more appropriate to describe the kinetics of the curing reaction. There are certain differences between the kinetic data from isothermal and that from nonisothermal measurements. The apparent activation energy Ea and pre-exponential factor A of E-AB1 determined from nonisothermal experiments were higher than the isothermal values, whereas the Ea and A of E-RV2 determined from both methods are relatively close.

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