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Effects of Solder Ball Geometry on Lap Shear Creep Rate

✍ Scribed by S. B. Kim; Jin Yu

Book ID
107455764
Publisher
Springer US
Year
2010
Tongue
English
Weight
577 KB
Volume
39
Category
Article
ISSN
0361-5235

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## Abstract The influence of cooling rate on the creep behavior of cast Sn–(1–5)%Bi solder alloys was studied by indentation testing at room temperature. The alloys were prepared at two different cooling rates of 0.01 Ks^–1^ and 8 Ks^–1^. This affected the microstructure and thus, the creep behavio