In this work we have studied the influence of thermal annealing on the structural and electrical properties of W-Ti thin films, deposited on n-type (100) silicon wafers. The films were deposited by d.c. sputtering from a 90:10 wt.% W-Ti target, using Ar ions, to a thickness of ~170 nm. After deposit
Effects of post annealing on the material characteristics and electrical properties of La doped BaTiO3 sputtered films
β Scribed by C.H. Wu; J.P. Chu; S.F. Wang; T.N. Lin; W.Z. Chang; V.S. John
- Publisher
- Elsevier Science
- Year
- 2008
- Tongue
- English
- Weight
- 588 KB
- Volume
- 202
- Category
- Article
- ISSN
- 0257-8972
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β¦ Synopsis
Dielectric constant Leakage current density
La-doped BaTiO 3 thin films with 200 nm thickness were fabricated by r.f. magnetron sputtering system onto Pt/Ti/SiO 2 /Si substrates. The effects of post-annealing and the amount of dopant on microstructure and electrical properties were studied. The X-ray diffraction (XRD) study reveals that, the film becomes crystallized when the annealing temperature is above 550 Β°C. In addition, all the films show tetragonal BaTiO 3 crystal structure without any second phase or reaction phase formation after annealed at 750 Β°C. The X-ray photoelectron spectroscopy (XPS) results provide the evidence to support the existence of La 2 O 3 with excess of BaTiO 3 structure, when the dopant content reaches more than 1.4 at.%. The dielectric constant also increases with increasing annealing temperature and it may be due to the better crystallinity and larger grain sizes. The 0.1 La film annealed at 750 Β°C shows a high dielectric constant of 487 measured at 1 MHz. The doped film in the as-deposited condition yields a reduction of leakage current was also observed.
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