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Effects of microstructure on the mechanical properties of copper films for high aspect ratio structures

✍ Scribed by M. J. Cordill; T. Muppidi; N. R. Moody; D. F. Bahr

Publisher
Springer-Verlag
Year
2004
Tongue
English
Weight
372 KB
Volume
10
Category
Article
ISSN
0946-7076

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