๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

Effects of heat treatment on electroless copper-deposited film in TaN diffusion barrier

โœ Scribed by Yong Sun Lee; Seok Woo Hong; Jong-Wan Park

Publisher
Elsevier Science
Year
2003
Tongue
English
Weight
419 KB
Volume
6
Category
Article
ISSN
1369-8001

No coin nor oath required. For personal study only.

๐Ÿ“œ SIMILAR VOLUMES

Evaluation of electroless deposited Co(W
Evaluation of electroless deposited Co(W,P) thin films as diffusion barriers for copper metallization
โœ A. Kohn; M. Eizenberg; Y. Shacham-Diamand; B. Israel; Y. Sverdlov ๐Ÿ“‚ Article ๐Ÿ“… 2001 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 231 KB

Electroless deposited Co(W,P) thin films were evaluated as diffusion barriers for copper metallization. Capacitance versus time measurements of MOS structures as well as SIMS depth profiles indicate that 30-nm-thick films can function as effective barriers against copper diffusion after thermal trea