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Effects of formaldehyde to urea mole ratio on thermal curing behavior of urea–formaldehyde resin and properties of particleboard

✍ Scribed by Byung-Dae Park; Eun Chang Kang; Jong Yong Park

Publisher
John Wiley and Sons
Year
2006
Tongue
English
Weight
89 KB
Volume
101
Category
Article
ISSN
0021-8995

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