Thermal curing behavior of modified urea-formaldehyde resin adhesives with two formaldehyde scavengers and their influence on adhesion performance

✍ Scribed by Byung-Dae Park; Eun-Chang Kang; Jong-Young Park

• Publisher: John Wiley and Sons
• Year: 2008
• Tongue: English
• Weight: 209 KB
• Volume: 110
• Category: Article
• ISSN: 0021-8995
• DOI: 10.1002/app.28748