Effects of electroplated Cu thickness and polyimide plasma treatment conditions on the interfacial fracture mechanics parameters in the Cu/Cr/polyimide system

✍ Scribed by Young Bae Park; Jin Yu

• Book ID: 105696348
• Publisher: TechnoPress
• Year: 2001
• Tongue: English
• Weight: 267 KB
• Volume: 7
• Category: Article
• ISSN: 1598-9623
• DOI: 10.1007/bf03026950