✦ LIBER ✦
Effect of Ar+Radiofrequency Plasma Treatment Conditions on the Interfacial Adhesion Energy Between Atomic-Layer-Deposited Al2O3and Cu Thin Films in Embedded Capacitors
✍ Scribed by Sung-Cheol Park; Young-Bae Park
- Publisher
- Springer US
- Year
- 2008
- Tongue
- English
- Weight
- 684 KB
- Volume
- 37
- Category
- Article
- ISSN
- 0361-5235
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