Analysis of the T-peel strength in a Cu/
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J.Y. Song; Jin Yu
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Article
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2002
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Elsevier Science
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English
β 196 KB
The T-peel strengths were measured using a Cu/Cr/polyimide system under varying metal layer thickness and rf plasma pretreatment conditions. Measured peel strength showed reversed camel back shape against the metal layer thickness, which is quite different from the results of the 90Β°peel test. Eleme