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Effects of a Ta interlayer on the titanium silicide reaction: C40 formation and scalability of the TiSi2 process

✍ Scribed by F La Via; S Privitera; F Mammoliti; M.G Grimaldi


Book ID
104305605
Publisher
Elsevier Science
Year
2002
Tongue
English
Weight
353 KB
Volume
60
Category
Article
ISSN
0167-9317

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✦ Synopsis


When a Ta layer is deposited at the Si-Ti interface a new phase has been detected, i.e., the TiSi C40. The 2 C40-C54 transformation kinetics and the film morphology are consistent with an increase of the nucleation density with respect to the C49-C54 transition. The activation energies for the nucleation rate (4.260.3 eV) and the growth velocity (4.060.4 eV) have been obtained from the in situ sheet resistance and the transmission electron microscopy results. These results show that the process with a Ta layer at the Ti-Si interface has a greater scalability with respect to the standard TiSi process.


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The formation of titanium disilicide (TiSi ) from Ti deposited using ionized metal plasma under different 2 deposition conditions has been investigated. It is shown that deposition at elevated substrate temperature (4508C) enhances the formation of the low-resistivity C54 TiSi , especially in patter