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Effect of tin-doped indium oxide film as capping layer on the agglomeration of copper film and the appearance of copper silicide

✍ Scribed by W.L. Liu; W.J. Chen; T.K. Tsai; S.H. Hsieh; C.M. Liu

Publisher: Elsevier Science
Year: 2007
Tongue: English
Weight: 930 KB
Volume: 253
Category: Article
ISSN: 0169-4332
DOI: 10.1016/j.apsusc.2006.12.075

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