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Effect of surface roughness of silicon die and copper heat spreader on thermal performance of HFCBGA

โœ Scribed by Tong Hong Wang; Sara N. Paisner; Chang-Chi Lee; Susan Chen; Yi-Shao Lai

Publisher
Elsevier Science
Year
2011
Tongue
English
Weight
778 KB
Volume
51
Category
Article
ISSN
0026-2714

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