✦ LIBER ✦

Effect of reaction time on mechanical strength of the interface formed between the Sn-Zn(-Bi) solder and the Au/Ni/Cu bond pad

✍ Scribed by Ahmed Sharif; Y. C. Chan

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Effect of Cu concentration on the reacti

✍ C. E. Ho; R. Y. Tsai; Y. L. Lin; C. R. Kao 📂 Article 📅 2002 🏛 Springer US 🌐 English ⚖ 625 KB

Reaction characteristics of the In-15Pb-

✍ Jong-Hyun Lee; Yong-Seong Eom; Kwang-Seong Choi; Byung-Seok Choi; Ho-Gyeong Yoon 📂 Article 📅 2004 🏛 Springer US 🌐 English ⚖ 523 KB

Effect of the soldering time on the form

✍ Jing Bo Wan; Yong Chang Liu; Chen Wei; Peng Jiang; Zhi Ming Gao 📂 Article 📅 2007 🏛 Springer US 🌐 English ⚖ 919 KB

Study of the Effects of Zn Content on th

✍ Chao-hong Wang; Hsien-hsin Chen 📂 Article 📅 2010 🏛 Springer US 🌐 English ⚖ 804 KB

Effect of Ni layer thickness and solderi

✍ Won Kyoung Choi; Hyuck Mo Lee 📂 Article 📅 1999 🏛 Springer US 🌐 English ⚖ 314 KB

Effect of thermal cycles on the mechanic

✍ Yoshiharu Kariya; Yasunori Hirata; Masahisa Otsuka 📂 Article 📅 1999 🏛 Springer US 🌐 English ⚖ 473 KB