Reaction characteristics of the In-15Pb-5Ag solder with a Au/Ni/Cu pad and their effects on mechanical properties

✍ Scribed by Jong-Hyun Lee; Yong-Seong Eom; Kwang-Seong Choi; Byung-Seok Choi; Ho-Gyeong Yoon; Jong-Tae Moon; Yong-Seog Kim

• Book ID: 107453185
• Publisher: Springer US
• Year: 2004
• Tongue: English
• Weight: 523 KB
• Volume: 33
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-004-0133-7