Effect of liquid additives in supercritical fluid deposition of copper for enhancing deposition chemistry

✍ Scribed by Takeshi Momose; Tomohiro Ohkubo; Masakazu Sugiyama; Yukihiro Shimogaki

• Book ID: 108290157
• Publisher: Elsevier Science
• Year: 2008
• Tongue: English
• Weight: 695 KB
• Volume: 517
• Category: Article
• ISSN: 0040-6090
• DOI: 10.1016/j.tsf.2008.07.037