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Effect of the molecular weight of polyethylene glycol as single additive in copper deposition for interconnect metallization

✍ Scribed by Shu-Ling Ko; Jeng-Yu Lin; Yung-Yun Wang; Chi-Chao Wan

Book ID: 108290052
Publisher: Elsevier Science
Year: 2008
Tongue: English
Weight: 742 KB
Volume: 516
Category: Article
ISSN: 0040-6090
DOI: 10.1016/j.tsf.2008.02.040

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