𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Effect of Curing Sequence on the Photopolymerization and Thermal Curing Kinetics of Dimethacrylate/Epoxy Interpenetrating Polymer Networks

✍ Scribed by Dean, Katherine; Cook, Wayne D.

Book ID
126136997
Publisher
American Chemical Society
Year
2002
Tongue
English
Weight
291 KB
Volume
35
Category
Article
ISSN
0024-9297

No coin nor oath required. For personal study only.

πŸ“œ SIMILAR VOLUMES

Curing behaviour of compatible interpene
Curing behaviour of compatible interpenetrating polymer networks based on epoxy and methacrylated epoxy
✍ Ming-Wei Wang; Cheng-Tzu Lee; Mu-Shih Lin πŸ“‚ Article πŸ“… 1997 πŸ› John Wiley and Sons 🌐 English βš– 345 KB πŸ‘ 2 views

Compatible interpenetrating polymer networks (IPNs) based on diglycidyl ether of bisphenol A (DGEBA) and methacrylated diglycidyl ether of bisphenol A (MADGEBA) in weight ratios of 100/0, 75/25, 50/50, 25/75 and 0/100 were blended and cured simultaneously by using dicumyl peroxide (DICUP) and hexahy

The effect of bismaleimide resin on curi
The effect of bismaleimide resin on curing kinetics of epoxy–amine thermosets
✍ R. Chandra; L. Rajabi; R. K. Soni πŸ“‚ Article πŸ“… 1996 πŸ› John Wiley and Sons 🌐 English βš– 621 KB

An analysis of the cure kinetics of several formulations composed of diglycidyl ether of bisphenol-A (DGEBPA) and aromatic diamines, methylenedianiline (MDA) and diaminodiphenyl sulfone (DDS), in the absence and presence of 4,4'-bismaleimidodiphenylmethane (BM) was performed. The dynamic differentia