✦ LIBER ✦

Effect of Cu Thickness on the Evolution of the Reaction Products at the Sn-9wt.%Zn Solder/Cu Interface During Reflow

✍ Scribed by Chih-hao Chen; Chi-pu Lin; Chih-ming Chen

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Morphological Evolution of the Reaction

✍ Chih-Ming Chen; Chih-Hao Chen; Chi-Pu Lin; Wen-Chiung Su 📂 Article 📅 2008 🏛 Springer US 🌐 English ⚖ 535 KB

The morphology and kinetic evolution of

✍ S. Y. Chang; L. C. Tsao; M. W. Wu; C. W. Chen 📂 Article 📅 2011 🏛 Springer US 🌐 English ⚖ 960 KB

Effects of Electromigration on Interfaci

✍ X.F. Zhang; J.D. Guo; J.K. Shang 📂 Article 📅 2008 🏛 Springer US 🌐 English ⚖ 364 KB

Effect of Stand-Off Height on Microstruc

✍ Fengshun Wu; Bo Wang; Bin Du; Bing An; Yiping Wu 📂 Article 📅 2009 🏛 Springer US 🌐 English ⚖ 417 KB

Effect of thermal cycling on the growth

✍ Guohai Chen; Xiaoyan Li; Jusheng Ma 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 452 KB

Effect of reaction time on mechanical st

✍ Ahmed Sharif; Y. C. Chan 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 361 KB