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Effect of copper seed aging on electroplating-induced defects in copper interconnects

✍ Scribed by Daniele Contestable-Gilkes; Deepak Ramappa; Minseok Oh; Sailesh M. Merchant

Book ID: 107452740
Publisher: Springer US
Year: 2002
Tongue: English
Weight: 585 KB
Volume: 31
Category: Article
ISSN: 0361-5235
DOI: 10.1007/s11664-002-0041-7

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Classified abstracts 3385-3397 sorption layer. After argon ion bombardment of oxide-and gascovered surface the electron excited exo-emission may be reduced almost down to the detection limit. After sorption or oxidation, the exe-emission increases again. It is concluded that the process which suppli