✦ LIBER ✦
Effects of wetting ability of plating electrolyte on Cu seed layer for electroplated copper film
✍ Scribed by Liu, Chi-Wen; Tsao, Jung-Chih; Tsai, Ming-Shih; Wang, Ying-Lang
- Book ID
- 121666086
- Publisher
- AVS (American Vacuum Society)
- Year
- 2004
- Tongue
- English
- Weight
- 637 KB
- Volume
- 22
- Category
- Article
- ISSN
- 0734-2101
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