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Dynamic characterization of surface-mount component leads for solder joint inspection : John H. Lau and Catherine A. Keely. IEEE Trans. Compon. Hybrids mfg Technol.12(4), 594 (1989)

Publisher: Elsevier Science
Year: 1990
Tongue: English
Weight: 139 KB
Volume: 30
Category: Article
ISSN: 0026-2714
DOI: 10.1016/0026-2714(90)90304-6

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