Elastoplastic analysis of surface-mount solder joints : John H. Lau, Donald W. Rice and Phil A. Avery. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-10, 346 (1987)

• Publisher: Elsevier Science
• Year: 1988
• Tongue: English
• Weight: 130 KB
• Volume: 28
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(88)90036-4