Diffusion of copper through dielectric films under bias temperature stress

✍ Scribed by Gopal Raghavan; Chien Chiang; Paul B. Anders; Sing-Mo Tzeng; Reynaldo Villasol; Gang Bai; Mark Bohr; David B. Fraser

• Book ID: 103432335
• Publisher: Elsevier Science
• Year: 1995
• Tongue: English
• Weight: 940 KB
• Volume: 262
• Category: Article
• ISSN: 0040-6090
• DOI: 10.1016/0040-6090(95)05839-7