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Dielectric analysis of the cure of thermosetting epoxy/amine systems

✍ Scribed by Sue Ann Bidstrup; Norman F. Sheppard Jr.; Stephen D. Senturia

Publisher
Society for Plastic Engineers
Year
1989
Tongue
English
Weight
391 KB
Volume
29
Category
Article
ISSN
0032-3888

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## Abstract Dielectric data collected at 2.45 Γ— 10^9^ Hz has been analyzed using a mean relaxation time model over the temperature range 50 to 100Β°C and at extents of cure from 0 to 57% for a stoichiometric DER 332 (Dow)/DDS (Aldrich) mixture. The relaxation times thus obtained obey the Arrhenius l