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Development of Metallic Hermetic Sealing for MEMS Packaging for Harsh Environment Applications

โœ Scribed by Vivek Chidambaram, Ho Beng Yeung, Gao Shan


Book ID
113087406
Publisher
Springer US
Year
2012
Tongue
English
Weight
696 KB
Volume
41
Category
Article
ISSN
0361-5235

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