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Development of Metallic Hermetic Sealing for MEMS Packaging for Harsh Environment Applications

✍ Scribed by Vivek Chidambaram, Ho Beng Yeung, Gao Shan

Book ID: 113087406
Publisher: Springer US
Year: 2012
Tongue: English
Weight: 696 KB
Volume: 41
Category: Article
ISSN: 0361-5235
DOI: 10.1007/s11664-012-2107-5

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