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[IEEE 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS) - Wanchai, Hong Kong, China (2010.01.24-2010.01.28)] 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS) - ALD-enabled hermetic sealing for polymer-based wafer level packaging of MEMS

✍ Scribed by Lin, Chingyi; Zhang, Yadong; Abdulagatov, Aziz; Yang, Ronggui; George, Steven; Lee, Y.C.

Book ID: 121331299
Publisher: IEEE
Year: 2010
Weight: 290 KB
Category: Article
ISBN: 1424457610
DOI: 10.1109/MEMSYS.2010.5442448

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