๐”– Bobbio Scriptorium
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Development of lead-free Sn-3.5Ag/SnO2nanocomposite solders

โœ Scribed by P. Babaghorbani; S. M. L. Nai; M. Gupta


Publisher
Springer US
Year
2008
Tongue
English
Weight
307 KB
Volume
20
Category
Article
ISSN
0957-4522

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The creep behavior of solders crucially influences solder joint reliability in microelectronic packages. This, in conjunction with the ongoing industry-wide transition to lead-free solders, has resulted in significant current emphasis on developing approaches for expeditiously creep testing miniatur