Development of a Nondestructive Method Utilizing X-ray Diffraction for the Evaluation of Grain Size Distributions of Cu Interconnects

✍ Scribed by Inami, Takashi; Onuki, Jin; Isshiki, Minoru

• Book ID: 115500262
• Publisher: The Electrochemical Society
• Year: 2011
• Tongue: English
• Weight: 701 KB
• Volume: 14
• Category: Article
• ISSN: 1099-0062
• DOI: 10.1149/1.3556985