The use of chemical-mechanical polishing (CMP) as a global planarization in ULSI process technology is increasing rapidly. In particular, to achieve the higher density and greater performance, the shallow trench isolation (STI)-CMP process has been attracting attention for multilevel interconnection
Design of experimental optimization for ULSI CMP process applications
โ Scribed by Sung-Woo Park; Chul-Bok Kim; Sang-Yong Kim; Yong-Jin Seo
- Publisher
- Elsevier Science
- Year
- 2003
- Tongue
- English
- Weight
- 488 KB
- Volume
- 66
- Category
- Article
- ISSN
- 0167-9317
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