✦ LIBER ✦
Design of experiment (DOE) method considering interaction effect of process parameters for optimization of copper chemical mechanical polishing (CMP) process
✍ Scribed by Nam-Hoon Kim; Min-Ho Choi; Sang-Yong Kim; Eui-Goo Chang
- Publisher
- Elsevier Science
- Year
- 2006
- Tongue
- English
- Weight
- 243 KB
- Volume
- 83
- Category
- Article
- ISSN
- 0167-9317
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