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Deposition of titanium nitride layers by electric arc – Reactive plasma spraying method

✍ Scribed by Şerban, Viorel-Aurel; Roşu, Radu Alexandru; Bucur, Alexandra Ioana; Pascu, Doru Romulus


Book ID
118415774
Publisher
Elsevier Science
Year
2013
Tongue
English
Weight
647 KB
Volume
265
Category
Article
ISSN
0169-4332

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Effects of substrate bias and argon flux
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## Abstract High‐quality titanium nitride (TiN) films with nano‐structure were prepared at ambient temperature on (111) silicon substrates by filtered cathodic arc plasma (FCAP) technology with an in‐plane “S” filter. The effects of substrate bias and argon flux on the crystal grain size, roughness