Degradation of electroless Ni(P) under-bump metallization in Sn3.5Ag and Sn37Pb solders during high-temperature storage

✍ Scribed by W. -M. Chen; P. Mccloskey; P. Byrne; P. Cheasty; G. Duffy; J. F. Rohan; J. Boardman; A. Mulcahy; S. C. O’Mathuna

• Publisher: Springer US
• Year: 2004
• Tongue: English
• Weight: 310 KB
• Volume: 33
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-004-0218-3