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Deep and fast plasma etching for silicon micromachining

โœ Scribed by M. Francou; J.S. Danel; L. Peccoud


Book ID
108028254
Publisher
Elsevier Science
Year
1995
Tongue
English
Weight
383 KB
Volume
46
Category
Article
ISSN
0924-4247

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Chemical vapour etching of silicon and p
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## Abstract In this work, we used HNO~3~/HF Vapour Etching (VE) of silicon (Si) wafers for the formation of different porous structures. Depending on the volume ratio of the HNO~3~/HF acid mixture, we can obtain Porous Silicon (PS) layers or a (NH~4~)~2~SiF~6~ like powder phase. These two kind of p