New epoxy-imide resins were synthesized using bis(hydroxyphthalimide)s (BHPIs). Among these resins, that cured with BHPI(DDS), synthesized from 4,4'-diaminodiphenykulfone, exhibits the best thermal resistance, reaching a tan8 maximum temperature of 230Β°C. This resin also features a tensile lap shear
Curing of epoxy resin using imide-amines
β Scribed by Pooja Sharma; Veena Choudhary; A. K. Narula
- Publisher
- John Wiley and Sons
- Year
- 2006
- Tongue
- English
- Weight
- 117 KB
- Volume
- 101
- Category
- Article
- ISSN
- 0021-8995
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